CDM ESD current characterization — Package variability effects and comparison to die-level CDM

Abstract

Analysis of Charged Device Model (CDM) current waveforms on multiple package options / styles shows significant variation with package size / pin count, package physical characteristics and pin location. Die-level CDM analysis shows much higher CDM peak current compared to their packaged counterparts. Thus, package-level CDM results cannot be substituted for die-level CDM results.