IEEE Journal of Solid-State Circuits · 2009 · 351 citations · 22 references
EngineeringElectrical EngineeringLow-power DesignMicroelectronicsWireless CommunicationsCmos Circuit DesignCommunication SystemsHigh-frequency Semiconductor DevicesMicrowave Integrated CircuitsMillimeter-wave CommunicationsRadio-frequency Integrated CircuitsCmos Radio-frequency CircuitsLow-power Cmos DesignMillimeter-wave Integrated CircuitsRadio Frequency TransceiversRf Cmos DesignTransceiver ArchitecturesTransceiver DesignWireless Data Transmission
This paper presents a low power 60 GHz transceiver that includes RF, LO, PLL and BB signal paths integrated into a single chip. The transceiver has been fabricated in a standard 90 nm CMOS process and includes specially designed ESD protection on all mm-wave pads. With a 1.2 V supply the chip consumes 170 mW while transmitting 10 dBm and 138 mW while receiving. Data transmission up to 5 Gb/s on each of I and Q channels has been measured, as has data reception over a 1 m wireless link at 4 Gb/s QPSK with less than 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-11</sup> BER.
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Journal of the Franklin Institute · 1963 · 5.8K citations
A silicon 60GHz receiver and transmitter chipset for broadband communications
Brian Floyd, Scott Reynolds, U. Pfeifer et al. · 2006 · 273 citations
Alexander Tomkins, Ricardo Aroca, Takuji Yamamoto et al. · IEEE Journal of Solid-State Circuits · 2009 · 156 citations