High‐Dielectric‐Constant Silver–Epoxy Composites as Embedded Dielectrics

B. I. Lee, Shufen Chen, William D. Samuels, Gregory J. Exarhos

Advanced Materials · 2005 · 431 citations · 17 references

Concepts

Abstract

The incorporation of organic-coated silver nanoparticles into an epoxy matrix (see Figure, a–f represent increasing Ag content) results in a flexible 0-3 type nanocomposite with a strikingly high dielectric constant (greater than 300). The composite retains the flexibility and other mechanical properties of the polymer matrix, and may be useful in applications where capacitors are embedded into printed circuit boards.

References

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