Computer aided design and packaging optoelectronic systems with free space optical interconnects

Abstract

An introduction to current research in computer-aided design (CAD) and packaging for optoelectronic systems utilizing free space optical interconnects is presented. New CAD tools are presented that allow layout of multistage networks based on CGH fabrication limitations and the subsequent synthesis of the interconnect holograms. Recent work involving double-sided alignment of a single substrate as well as alignment techniques between two different substrates is discussed. Several packaged systems utilizing photorefractive crystals to minimize alignment problems are also presented.