Nanotechnology · 2007 · 45 citations · 30 references
EngineeringCarbon NanotechnologyMolecular Self-assemblyBiomedical EngineeringAssembled SwntsGraphene NanomeshesCarbon-based MaterialNanoelectronicsThree-dimensional AssemblyCarbon NanotubesMaterials ScienceNanotechnologyHybrid ApproachNano ApplicationFlexible ElectronicsNanomaterialsSelf-assemblyGraphene FiberApplied PhysicsNano Electro Mechanical SystemTop-down FabricationNanotubes
We present a hybrid approach that combines top-down fabrication with bottom-up directed assembly for making single-walled carbon nanotube (SWNT) based three-dimensional interconnects. The SWNTs are assembled using dielectrophoresis at room temperature on a microfabricated 3D platform. The two-terminal resistance of the assembled SWNTs at 10 Vpp assembly voltage is approximately 545 Ω. Simulation of the dielectrophoretic assembly is carried out to understand the behavior of the SWNTs during assembly. Encapsulation of these devices using a conformal pinhole-free parylene layer resulted in a decrease of the total resistance.
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Separation of Metallic from Semiconducting Single-Walled Carbon Nanotubes
Ralph Krupke, Frank Hennrich, H. v. Löhneysen et al. · Science · 2003 · 1.5K citations
Materials Science, One-dimensional Material, Nano Application +13
Phaedon Avouris · Chemical Physics · 2002 · 896 citations
Phaedon Avouris, Joerg Appenzeller, Richard Martel et al. · Proceedings of the IEEE · 2003 · 648 citations
Bottom-up approach for carbon nanotube interconnects
Jun Li, Qi Ye, Alan M. Cassell et al. · Applied Physics Letters · 2003 · 519 citations · Full text
Materials Science, Electrical Engineering, Wafer Scale Processing +14