IEEE Microwave and Wireless Components Letters · 2001 · 58 citations · 6 references
Low-power ElectronicsElectrical EngineeringEngineeringRadio FrequencyCmos Power AmplifierMixed-signal Integrated CircuitMultilayer Ltcc BoardFirst DemonstrationMultilayer Ltcc PassivesMicroelectronicsMicrowave EngineeringRf Subsystem
We present the first demonstration of a CMOS power amplifier (PA) utilizing fully integrated multilayer low-temperature co-fired ceramic (LTCC) high-Q passives for 1.9-GHz digital European cordless telecommunications (DECT) applications. The inductor and capacitor library were built in a multilayer LTCC board using a compact topology. An inductor Q-factor as high as 100 with a self-resonant frequency (SRF) as high as 8 GHz was demonstrated. Measured results of the CMOS-LTCC PA show good agreement with the simulated results exhibiting 48% power added efficiency, 26-dBm output power and 17-dB gain at 1.9 GHz with a 3.3-V drain supply voltage. This result is the first significant step toward a compact DECT transceiver module development utilizing fully integrated multilayer LTCC passives and a standard CMOS technology.
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A DECT transceiver chip set using SiGe technology
M. Bopp, Michael L. Alles, Michael Arens et al. · 2003 · 24 citations
Complete Transceiver, Electrical Engineering, Engineering +13