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Electrochemical kinetic parameters for the cathodic deposition of copper from dilute aqueous acid sulfate solutions
27
Citations
23
References
1991
Year
ElectrometallurgyChemical EngineeringEngineeringCorrosionSurface ElectrochemistryCathodic DepositionKinetic ParametersSimulated Acid‐copperElectrochemical Kinetic ParametersWaste SolutionChemistryElectrochemical ProcessChemical KineticsElectrode Reaction MechanismElectrochemistryElectrochemical Surface Science
Abstract The use of linear‐sweep voltammetry and chronopotentiometry for the determination of kinetic parameters for the electrolytic recovery of copper from a simulated acid‐copper electroplating waste solution was demonstrated. For the electrodeposition of copper from solutions of 0.007˜0.008 mol/L CuSO 4 + 0.5 mol/L H2SO 4 at 25°, the recommended values of the transfer coefficient (α) and exchange current density (i 0 ) are α = 0.46±0.06 (95% confidence interval) and i 0 = 11±4 A/m 2 . The close agreement between these values and the available literature values indicates the reliabilaity of the voltammetric and chronopotentiometric methods.
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