2011 IEEE MTT-S International Microwave Symposium · 2011 · 95 citations · 4 references
EngineeringElectrical EngineeringMicroelectronicsMicrowave EngineeringSemiconductor DevicesMicrowave AmplifiersMicrowave Semiconductor DevicesPower AmplifiersWide Band Gap SemiconductorsWide-bandgap Semiconductor DevicesWide-bandgap SemiconductorsGallium Nitride (Gan) MaterialsGallium Nitride Power AmplifiersGan-based High-frequency DevicesHigh-efficiency Power AmplifiersMicrowave Amplifier DesignPower Amplifier DesignRadio Frequency Power AmplifiersRadio-frequency Power Devices
An advanced high power, high frequency GaN semiconductor process has made possible the design and fabrication of W-band power amplifier MMICs with unprecedented performance. The key enabling semiconductor technology is a 150 nm T-gate GaN HEMT with an output power exceeding 300 mW and a peak PAE (power added efficiency) of 37%. With this process, W-band power amplifier MMICs have been designed and fabricated that demonstrate output powers of 1.7 watts, power added efficiencies greater than 20%, and small signal gains of 21 dB. In addition, the compactness of these MMIC designs have allowed for MMIC power densities (MMIC output power relative to MMIC area) exceeding 1/2 watt/mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> .
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Spatial power combining for high-power transmitters
James Harvey, E. R. Brown, D.B. Rutledge et al. · IEEE Microwave Magazine · 2000 · 74 citations