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CVD of Copper Oxides from a β-Diketonate Diamine Precursor: Tailoring the Nano-Organization
75
Citations
63
References
2009
Year
EngineeringNanoheterogeneous CatalysisChemistryChemical DepositionCopper OxidesChemical EngineeringNanoscale ChemistryElectron MicroscopyNanostructure SynthesisMaterials ScienceInorganic ChemistryNanotechnologyNanomanufacturingNanocrystalline MaterialFourier TransformCopper Oxide MaterialsNanomaterialsSurface ScienceCopper OxideChemical Vapor Depositionβ-Diketonate Diamine PrecursorNanoarchitectonics
A copper(II) hexafluoroacetylacetonate (1,1,1,5,5,5-hexafluoro-2,4-pentanedionate, hfa) adduct with N,N,N′,N′-tetramethylethylenediamine (TMEDA) [Cu(hfa)2·TMEDA] is used for the first time as precursor for the chemical vapor deposition (CVD) of copper oxide nanosystems. The syntheses are carried out under both O2 and O2+H2O reaction atmospheres on Si(100) substrates, at temperatures ranging between 250 and 550 °C. Subsequently, the interrelations between the preparative conditions and the system composition, nanostructure, and morphology are elucidated by means of complementary analytical techniques [Fourier transform infrared spectroscopy (FT-IR), X-ray photoelectron and X-ray excited auger electron spectroscopies (XPS and XE-AES), glancing incidence X-ray diffraction (GIXRD), field emission scanning electron microscopy (FESEM), transmission electron microscopy (TEM)]. The obtained data revealed a gradual transformation from Cu2O, to Cu2O + CuO, to CuO nanosystems upon increasing the deposition temperature from 250 to 550 °C under both growth atmospheres. Such a phenomenon was accompanied by a progressive morphological evolution from continuous films to 1D hyperbranched nanostructures. Water vapor introduction in the deposition environment enabled to lower the deposition temperature and resulted in a higher aggregate interconnection, attributed to a higher density of nucleation centers.
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