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Thermal expansion of reference materials: copper, silica and silicon
205
Citations
17
References
1973
Year
Materials ScienceMaterials EngineeringHigh Temperature MaterialsEngineeringThermal ExpansionApplied PhysicsVitreous SilicaThermal AnalysisThermophysical PropertyThermophysicsThermodynamicsChemistryLinear Coefficient αThermal EngineeringThermal ConductivityThermal PropertyThermal Properties
Between 30 and 290 K the thermal expansion of vitreous silica is shown to be particularly sensitive to thermal history. Values given for the linear coefficient α were determined relative to copper, and existing reference data for copper are discussed. α for silicon has also been measured relative to copper from 55 K to room temperature. Values of α at 283 K are reported for a number of samples of copper, and for Ag, Au, Al, Pt, Pd, MgO, NaCl and CaF2.
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