A 120-W X-band spatially combined solid-state amplifier

TLDR

The paper presents a broad‑band spatial power‑combining system for X‑band waveguide environments. The system employs 24 GaAs MMIC amplifiers with tapered‑slot antenna arrays to deliver 126 W output and ±1.9 dB gain variation over 8–11 GHz. The hybrid combiner is device‑agnostic, supports up to 415 W DC, offers modular maintenance and variable output, and tolerates device failures with graceful degradation.

Abstract

In this paper, we present new results in the development of a broad-band spatial power-combining system implemented in a standard X-band waveguide environment. Using 24 off-the-shelf GaAs monolithic-microwave integrated-circuit (MMIC) power amplifiers integrated with tapered-slot antenna arrays, the new combining circuit produced up to 126-W maximum power output with a gain variation of /spl plusmn/1.9 dB within the band of interest (8-11 GHz). This hybrid circuit combiner is transparent to the device technology, and also provides an excellent heat-sinking capacity, sustaining as much as 415 W of dc power consumed by the MMIC amplifiers. The modular architecture allows easy maintenance, variable output power level, and modular assembly. Results on graceful degradation are also presented, showing superb tolerance to device failure.