Silicon Micromachined W-Band Hybrid Coupler and Power Divider Using DRIE Technique

Abstract

In this letter, a silicon micromachined W-band hybrid coupler and a power divider using deep-reactive ion etching (DRIE) technique are presented. They are designed in the H-plane of rectangular waveguide to utilize DRIE technique. The hybrid coupler adopts a ridged waveguide 90deg phase shifter and a joint waveguide. The power divider utilizes a T-shape configuration. The simulated and measured response of each circuit are presented in this letter where good agreement between them is achieved. Then, the measured combining efficiency is reported by cascading the power divider and the hybrid coupler.