Modeling, Design, and Characterization of Multiturn Bondwire Inductors With Ferrite Epoxy Glob Cores for Power Supply System-on-Chip or System-in-Package Applications

Abstract

The concept of coupled multiturn bondwire inductors with ferrite epoxy glob cores is investigated both experimentally and numerically to offer a cost-effective approach realizing power supply system-on-chip (PSoC) or system-in-package (PSiP). Improvement in total inductance and Q factor is demonstrated for the multiturn bondwire inductors due to the coupling effect. An empirical calculation method is developed to help determine the self and mutual inductance of the proposed bondwire inductors. The bondwire magnetic components can be easily integrated into IC packaging processes with minimal changes, and open possibilities for realizing cost-effective, high-current, and high-efficiency PSoCs or PSiPs.