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Modeling of void closure in diffusion bonding process based on dynamic conditions

Materials ScienceMaterials EngineeringEngineeringDiffusion ResistanceMechanicsMechanical EngineeringApplied PhysicsDynamic ConditionsDiffusion ProcessMaterial ModelingContinuum ModelingSolid MechanicsDefect FormationElectronic PackagingVoid ClosureMechanics Of Materials