IEEE Transactions on Applied Superconductivity · 1997 · 40 citations · 7 references
Natural SciencesElectrical EngineeringMaterials ScienceCondensed Matter PhysicsElectronic MaterialsMicroelectronicsElectrical ConductivityNoise In Electronic DevicesNoise In Semiconductor DevicesSuperconducting MaterialsSuperconducting Thin FilmsThin Film Electrical PropertiesCharge Transport MechanismsCritical Current DensityCurrent DensityFilm ThicknessJosephson JunctionsStep AngleThin Oxide FilmsTransport Mechanisms
We have fabricated step edge junctions using MgO substrates and YBCO thin films. By varying the angle of the step edge over a range of angles up to 45/spl deg/, we have obtained 3 distinct step edge morphologies: a deep trench junction, a double junction and a single junction. We found that only the step angle and morphology affected the critical current density (I/sub c/) and that the film thickness-to-step height ratio had no effect over the range 0.2-1.1. Noise measurements indicated that the single junction steps had the lowest level of critical current fluctuations and the highest values of dynamic resistance. We have also studied the variation of I/sub c/ with temperature and found it follows the Ambergaokar-Baratoff model with a lower zero energy gap. We use this information to confirm that the junction parameters are affected by the c-axis tilt and the in-plane orientations proposed by others and consider the transport mechanisms across the junction.
7
Tunneling Between Superconductors
Vinay Ambegaokar, A. Baratoff · Physical Review Letters · 1963 · 2.2K citations
Correlation of YBa2Cu3O7 step-edge junction characteristics with microstructure
K. Herrmann, G. Kunkel, M. Siegel et al. · Journal of Applied Physics · 1995 · 57 citations