Quantitative adhesion measures of multilayer films: Part II. Indentation of W/Cu, W/W, Cr/W - Concepedia

Concepedia

Publication | Closed Access

Quantitative adhesion measures of multilayer films: Part II. Indentation of W/Cu, W/W, Cr/W

98

Citations

22

References

1999

Year

Michael D. Kriese, W. W. Gerberich, Neville Reid Moody

Journal of materials research/Pratt's guide to venture capital sources

Materials ScienceQuantitative Adhesion MeasuresMultilayer FilmsEngineeringAdhesive MaterialMechanical EngineeringElectronic PackagingSurface ProcessingThin Film ProcessingPart Ii

References

	Year	Citations

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