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GaAs MQW modulators integrated with silicon CMOS
245
Citations
10
References
1995
Year
Electrical EngineeringEngineeringDevice IntegrationMixed-signal Integrated CircuitApplied PhysicsFlip-chip Solder-bondingQuantum DevicesIntegrated CircuitsMicron Solder PadsMicroelectronicsGaas-algaas Multiple QuantumGaas Mqw Modulators
We demonstrate integration of GaAs-AlGaAs multiple quantum well modulators to silicon CMOS circuitry via flip-chip solder-bonding followed by substrate removal. We obtain 95% device yield for 32/spl times/32 arrays of devices with 15 micron solder pads. We show operation of a simple circuit composed of a modulator and a CMOS transistor.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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