Statistical modeling of cross-coupling effects in VLSI interconnects

Abstract

In this paper, we develop an approach for statistical modeling of crosstalk noise and dynamic delay degradation in coupled RC interconnects under process variations. The proposed model enables closed-form computation of mean and variance of noise peak and worst case dynamic delay for given variabilities in physical dimensions. We compare the proposed model against HSPICE Monte Carlo simulations and report an average error in mean and standard deviation of noise peak to be 2.7% and 3.7% respectively.