Modeling the dielectric behavior of epoxy resin blends during curing

Abstract

Abstract A model is developed to describe the evolution of dielectric behavior during the cure of epoxy resins and of blends containing soluble polymeric additives. Data on cure kinetics are used to predict: (a) changes in viscosity and hence in ion mobility; (b) gelation times; (c) vitrification times; and (d) dipolar relaxation times, for both resin and blends. These predictions are then used in conjunction with the Maxwell‐Wagner‐Sillars (MWS) theory to calculate dielectric permittivity ϵ′ and loss ϵ″ as functions of cure time and test frequency in both resin and blends. The predictions are compared with experimental data on dielectric behavior obtained during cure of both neat epoxy resin and of blends containing 15 wt% CTBN (carboxyl‐terminated poly(butadiene‐co‐acrylonitrile)).