Publication | Closed Access
Energy-Efficient Single Flux Quantum Technology
521
Citations
39
References
2011
Year
EngineeringVlsi DesignComputer ArchitectureCircuit Power DissipationQuantum ComputingSuperconductivityQuantum EntanglementSuperconducting DevicesQuantum ScienceElectrical EngineeringPhysicsQuantum DeviceComputer EngineeringStandard Rsfq LogicMicroelectronicsLow-power ElectronicsQuantum TechnologyLogic FamiliesNatural SciencesApplied Physics
Figures of merit such as OpS/Watt and Joule/bit are becoming dominant factors in selecting technologies for next‑generation computing and communication systems, and superconductivity is seen as a promising path to higher energy efficiency, though static power dissipation from RSFQ logic’s dc bias resistors remains a major challenge. This paper reviews and compares different superconductor digital technology approaches and logic families that address static power dissipation, introduces the novel ERSFQ/eSFQ logic family, and discusses energy‑efficient output data interfaces and cryosystem designs. The authors conduct a comparative analysis of existing superconductor logic families, present the ERSFQ/eSFQ architecture, and outline design strategies for low‑power output interfaces and cryogenic systems.
Figures of merit connecting processing capabilities with power dissipated (OpS/Watt, Joule/bit, etc.) are becoming dominant factors in choosing technologies for implementing the next generation of computing and communication network systems. Superconductivity is viewed as a technology capable of achieving higher energy efficiencies than other technologies. Static power dissipation of standard RSFQ logic, associated with dc bias resistors, is responsible for most of the circuit power dissipation. In this paper, we review and compare different superconductor digital technology approaches and logic families addressing this problem. We present a novel energy-efficient single flux quantum logic family, ERSFQ/eSFQ. We also discuss energy-efficient approaches for output data interface and overall cryosystem design.
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