A Self‐healing Conductive Ink

Abstract

Electrical conductivity of mechanically damaged silver ink circuits is automatically restored using core–shell microcapsules. Upon mechanical damage to the circuit and microcapsules, silver particles reorganize by dissolution of the polymer binder layer upon release of solvent, hexyl acetate, from microcapsule cores. Conductivity is restored within minutes of damage, and no short-circuiting is revealed during the healing of closely spaced lines. Detailed facts of importance to specialist readers are published as ”Supporting Information”. Such documents are peer-reviewed, but not copy-edited or typeset. They are made available as submitted by the authors. Please note: The publisher is not responsible for the content or functionality of any supporting information supplied by the authors. Any queries (other than missing content) should be directed to the corresponding author for the article.