Publication | Closed Access
Theory and experiment of novel frequency selective surface based on substrate integrated waveguide technology
191
Citations
35
References
2005
Year
Electrical EngineeringEngineeringAntennaNormal Pcb ProcessFrequency Selective SurfacesMicrowave AntennaSiw CavitiesGuided-wave OpticComputational ElectromagneticsWhole FssMicrowave EngineeringPlanar Waveguide SensorElectromagnetic Compatibility
A novel frequency selective surface based on substrate integrated waveguide technology is investigated through simulation and experiment. The FSS consists of a periodic SIW cavity with slots on top and bottom, fabricated on a microwave substrate using standard PCB process, and its transmission and reflection were simulated with finite difference frequency domain method and validated experimentally. The high‑Q SIW cavities improve frequency selectivity, yielding low‑loss low‑passband performance that is insensitive to incident angle and polarization, with simulation and experiment agreeing and demonstrating easy, low‑cost PCB fabrication.
A novel frequency selective surface (FSS) based on substrate integrated waveguide (SIW) technology is investigated with simulation and experiment. The periodic unit is made of a SIW cavity with slots on the top and bottom surfaces, and the whole FSS is fabricated on a microwave substrate with standard PCB process. The high-Q property of SIW cavities greatly improved the frequency selectivity of the FSS, which is significant for the application in antenna cover or object stealth etc. The finite difference frequency domain (FDFD) method is adopted to simulate the transmission and reflection characteristics of the proposed FSS, and the simulated results are in good agreement with the experiment data. Both simulated and experiment results show that the FSS proposed in this paper takes the advantages of low passband insertion loss, good frequency selectivity, and insensitive to the incident angle and polarization etc. Besides, the FSS can be easily fabricated using normal PCB process with low cost.
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