Novel RC Compact Thermal Model of HV Inverter Module for Electro-Thermal Coupling Simulation

Abstract

This paper describes a novel RC compact thermal model which has the capability of representing thermal behavior of multi chip inverter module peculiar to HV. This RC compact thermal model can take into account lateral heat spreading within the modules and thermal interference among Si chips. The thermal model was validated in comparison of temperature transient responses among the results calculated using the proposed model and FEM. The electro-thermal coupling simulation using this RC compact thermal model offers reasonable accuracy for prediction of the Si chip temperature in HV inverter module.