77-GHz-band surface mountable ceramic package

Abstract

The authors have developed a surface mount-type ceramic package for 77-GHz millimeter-wave application. The package has a new terminal structure for surface mount and a feedthrough of electromagnetic coupling. The authors have adopted a coplanar structure for the surface mount terminal. The structure for the electromagnetic coupling consists of microstrip line/slot/microstrip line (MSL/SLOT/MSL). Total transmission loss between the signal line on board and the RF input-output terminal inside the package was 1.0 dB at 77 GHz Standard deviation of the insertion loss was 0.08 dB (n = 57) The authors have confirmed that the surface mountable package shows high transmission characteristics as well as high reliability.