Three‐pole cross‐coupled substrate‐integrated waveguide bandpass filters based on PCB process and multilayer LTCC technology

Abstract

Abstract This letter presents the design, implementation and experiment of planar and multilayer three‐pole cross‐coupled bandpass filters realized by substrate‐integrated waveguide (SIW). The two three‐pole filters centered at 10 GHz with one transmission zero are simulated by using full‐wave electromagnetic (EM) simulator. Then they are fabricated with printed circuit board (PCB) process and with multilayer low‐temperature co‐fired ceramic (LTCC) technology, respectively. By the comparison between the two filters, it is easily seen that the multilayer SIW filter based on LTCC technology occupies a very small area while obtaining good performance. The measured results coincide with the simulated results very well and show the superiority of multilayer LTCC technology. © 2008 Wiley Periodicals, Inc. Microwave Opt Technol Lett 51: 71–73, 2009; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.23972