Preparation and thermal properties of epoxy composites filled with negative thermal expansion nanoparticles modified by a plasma treatment

Abstract

Epoxy composites filled with negative thermal expansion nanoparticles, Mn 3 (Cu 0.6 Si 0.15 Ge 0.25 )N, modified by a plasma treatment were prepared. Thermal expansion properties and thermal conductivities of the Mn 3 (Cu 0.6 Si 0.15 Ge 0.25 )N/ epoxy composites were investigated within the temperature range of 77—300 K. Compared to neat epoxy resin, Mn 3 (Cu 0.6 Si 0.15 Ge 0.25 )N/epoxy composites show remarkably lower coefficient of thermal expansions (CTEs) and higher thermal conductivities. Especially for the composite with 32 vol.% of Mn 3 (Cu 0.6 Si 0.15 Ge 0.25 )N, the reduction of CTE value up to 42% in the temperature range of 77—195 K, and the thermal conductivities are 2.8 and 4 times as large as those of the neat epoxy resin at 298 and 77 K, respectively.