The effect of compounding on the conductive properties of EMI shielding compounds

Abstract

Abstract Conductive fillers are currently being evaluated for their ability to produce conductive plastic parts which shield electromagnetic interference (EMI). These fillers all have a geometrical characteristic to them which makes them susceptible to damage during compounding and processing. In this paper the effects of compounding and processing on the electrical properties of compounds produced from a variety of conductive fillers are presented. These fillers include carbon black, carbon fibers, aluminum‐coated glass fibers, stainless steel fibers, and aluminum flakes. Thermoplastic polymers were used as matrices in the preparation of the conductive compounds. This study shows that a balance must be reached between dispersive mixing requirements and minimizing damage to the filler particles.