Off-Optimum Cure of Aerospace Epoxy Adhesives

Abstract

Abstract Four epoxy film adhesives used in aircraft manufacture and repair have been examined to establish the effect of deviation from the cure cycle specified by the manufacturer. In addition to the variation of the cure cycle, two surface preparations of the aluminium adherends (chromic acid etch or grit blast followed by silane treatment) were evaluated. Thermal analysis was used to examine the cure envelope of the adhesive, and its extent of cure and glass transition temperature. The adhesive properties were assessed by shear strength (in both single lap joints and in Iosipescu configuration), durability (Boeing wedge test) and chemical resistance to selected aggressive fluids. The sensitivity of the performance of a particular adhesive to offoptimum cure conditions depends on its composition and needs to be determined, not predicted.