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Simultaneous double-sided deposition of HTS films on 3-inch wafers by ICM-sputtering
28
Citations
2
References
1999
Year
EngineeringChemical Deposition3-Inch WafersRf SemiconductorSuperconductivityHeating CavityPulsed Laser DepositionThin Film ProcessingMaterials ScienceMaterials EngineeringElectrical EngineeringSimultaneous Double-sided DepositionSemiconductor Device FabricationMicroelectronicsHts FilmsSurface ScienceApplied PhysicsSimultaneous DepositionThin FilmsOptoelectronicsChemical Vapor Deposition
The construction of a system which allows simultaneous deposition of HTS films on both sides of 3-inch wafers is described. The wafers are placed in a heating cavity which can be heated to 1000/spl deg/C. Deposition is accomplished through two opposite holes in the cavity by inverted cylindrical magnetron (ICM) sputtering guns. YBaCuO films deposited on 3 inch CeO/sub 2/ buffered sapphire substrates revealed a growth quality and T/sub c/ and j/sub c/ values comparable to standard films with sufficient uniformity on both sides of the wafer. The surface resistance of the films measured in the frequency range of 2.68 to 145 GHz is 20 m/spl Omega/ at the highest frequency.
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