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Surface Chemistry of Sputter‐Deposited Al‐Mo and Al‐Cr Alloys Polarized in 0.1N KCl
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1989
Year
Aluminium NitrideEngineeringOxidation ResistanceSputter‐deposited Al‐moChemistryChemical EngineeringCorrosionSolidificationPassive FilmCorrosion ResistanceAlloysMaterials ScienceSolute ConcentrationBarrier LayerAl‐cr Alloys PolarizedSurface ChemistrySurface ScienceApplied PhysicsThin FilmsAlloy Phase
A study was performed to investigate the changes that take place in the chemistry of the passive film that forms on Al alloys containing either Mo or Cr, as a function of solute concentration and applied potential in . The results show that the mechanisms by which the solute protects the Al alloy differ. Molybdenum forms a film containing that impedes the ingress and movement of the Cl− anion in the film. In contrast, Cr forms a barrier layer that inhibits the oxidation of the Al substrate and restricts the Cl− anions from reaching the metal/film interface. The results show that pitting of Al‐Mo alloys occurs when sufficient is replaced by hydrated Mo+4 compounds, whereas pitting of the Al‐Cr alloys occurs when Cr+3 is oxidized to the more soluble Cr+6 state.