Structure and properties of polyimide films during a far‐infrared‐induced imidization process

Abstract

Abstract The conversion of poly(amic acid) into polyimide (PI) was achieved with far‐infrared radiation (FIR) and conventional thermal treatments. The structure and properties of PI films during different stages of imidization were studied with Fourier transform infrared spectroscopy, weight‐loss analysis during imidization, tensile property measurements, and dynamic mechanical thermal analysis. The effects of the imidization degree, postimidization, and solvent on the thermal and mechanical properties of PI films were quantitatively investigated. The corresponding structural changes were also examined. The experimental results showed that the imidization process proceeded more quickly and more completely in an FIR oven than in a conventional oven. A prolonged FIR treatment at a lower temperature (25–100 °C) accelerated the imidization process. The tensile stress–strain curves had a fanlike distribution with the development of the FIR imidization process and a fishtail distribution with conventional thermal imidization. During FIR imidization, the best tensile properties were obtained at 340 °C, and thermooxidative degradation occurred at about 420 °C. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 2490–2501, 2004