Ultra-low-? polyimide hybrid films via copolymerization of polyimide and polyoxometalates

Abstract

Novel polyimide hybrid films in which nanoscale polyoxometalates (POM) clusters are covalently linked with the polymer chains exhibit not only drastically reduced dielectric constants relative to neat polyimide film, as low as 1.22, but also improved thermal stability, and mechanical properties without sacrificing the transparency of the polymer films.