Concepedia

Abstract

Compact 12-channel LED/PD (light emitting diode/photodiode) array modules using novel assembly techniques have been developed for high-speed parallel optical transmission. Optical and electronic devices were mounted on a lateral point and the common submount surfaces, respectively, for high-speed operation and module package miniaturizing. The flip-chip technique by solder bumps was employed for optical array chip bonding, in order to simplify the chip mounting., A 12-channel 150- Mbit/s/ch 100-m parallel optical transmission with small electronic crosstalk has been demonstrated.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>

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