Proceedings of the IEEE · 1998 · 177 citations · 55 references
EngineeringCommunicationElectrical EngineeringCircuit TheoryDigital CommunicationPropagationElectrical WiringIntegrated Circuit DesignInterconnect ArchitectureInterconnect DesignInterconnect TechnologyTransmission LinesCoupled Transmission LinesHigh-density InterconnectsInterconnect CharacterizationLossless Transmission LinesLossy Transmission LinesMeasurement TechniquesOn-chip InterconnectsPrinted Circuit Boards
High‑density, high‑performance interconnections in digital and communication systems act as lossy transmission lines, and their key properties are explained theoretically. The study introduces a new short‑pulse propagation technique to characterize a broad class of interconnect wiring. The authors detail the technique’s application to shielded cables, PCBs, ceramic carriers, thin‑film, and on‑chip wiring, including modeling and measurement methods. Representative examples illustrate key performance‑limiting parameters, and the authors discuss future technological directions and their impact on performance.
A review is presented of the electrical characteristics of high-density, high-performance interconnections used in digital and communication applications. These interconnections behave as lossy transmission lines for the frequency range of interest. A brief theoretical explanation of the key properties of lossy, coupled transmission lines is given. A new short-pulse propagation technique used for characterizing a large category of wiring is described. A detailed description is made of each of the major interconnect types encountered namely, shielded cables, printed circuit boards, ceramic carriers, thin-film wiring, and on-chip wiring. Representative examples are given in each case to highlight the key performance-limiting parameters. The modeling and measurement techniques used are explained and examples are given. Future technological directions and their effect on performance are discussed.
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H.A. Wheeler · Proceedings of the IRE · 1942 · 749 citations
Microelectronics Packaging Handbook
Rao Tummala, Eugene J. Rymaszewski, Y. C. Lee · Journal of Electronic Packaging · 1989 · 535 citations