Two‐Dimensionally Ordered Copper Grid Patterns Prepared via Electroless Deposition Using a Colloidal‐Crystal Film as the Template

Abstract

Abstract Two‐dimensionally ordered copper grid patterns with different pore sizes and thickness have been fabricated via electroless copper deposition using a colloidal‐crystal film as the template. The pore size of the grid can be adjusted by altering the deposition time. The copper films, with thicknesses of ≈ 100–130 nm and pore sizes of ≈ 100 nm, are flexible and can be peeled off a silicon wafer and rolled up into a reel. Three‐dimensionally ordered porous copper materials have also been prepared using a similar method.