Effects of Electroplating Variables on the Voltammetric Properties of Bismuth Deposits Plated Potentiostatically

Abstract

Abstract An attempt is made to describe the electrochemical properties of bismuth films, plated in‐situ on glassy carbon in acetic buffer, over a broad range of deposition potentials. It is shown that accumulation during anodic stripping voltammetric determination of lead and zinc at the bismuth film electrode depends to a large extent on the electrolyte composition and the plating parameters. The influence of the plating potential on Pb deposition is moderate, but it could not be disregarded during Zn quantification. The sources of electrode poisoning effects are discussed in detail. Voltammetric studies are complemented by AFM microscopic observations.