A Combined Top‐Down and Bottom‐Up Approach for Precise Placement of Metal Nanoparticles on Silicon

Abstract

Bottoms up! The techniques of laser interference lithography and coarsening of Au dots are combined and used to place Au nanoparticles in inverted pyramids at precise locations on silicon surfaces. The fabrication process is robust against variations in the topographic factor, for example, pit-to-mesa width ratio. Excellent tunability of the diameter of the nanoparticles is achieved by a careful manipulation of Au thickness and annealing condition.