Predictive Modeling of the NBTI Effect for Reliable Design

Abstract

This paper presents a predictive model for the negative bias temperature instability (NBTI) of PMOS under both short term and long term operation. Based on the reaction-diffusion (R-D) mechanism, this model accurately captures the dependence of NBTI on the oxide thickness (t <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ox</sub> ), the diffusing species (H or H <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> ) and other key transistor and design parameters. In addition, a closed form expression was derived for the threshold voltage change (DeltaV <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th </sub> ) under multiple cycle dynamic operation. Model accuracy and efficiency were verified with 90-nm experimental and simulation data. The impact of NBTI was further investigated on representative digital circuits