Publication | Open Access

Observation and Modelling of Electromigration-Induced Void growth in Al-Based Interconnects

Materials EngineeringAluminium NitrideElectrical EngineeringElectromigration TechniqueEngineeringSurface ScienceApplied PhysicsTime-dependent Dielectric BreakdownElectronic PackagingMicroelectronicsElectromigration-induced Void GrowthInterconnect (Integrated Circuits)Electrical InsulationInterface Phenomenon