Observation and Modelling of Electromigration-Induced Void growth in Al-Based Interconnects

Fatal electromigration voids in narrow aluminum-copper interconnect

J. H. Rose · Applied Physics Letters · 1992 · 94 citations

Natural Sciences, Electrical Engineering, Materials Science +14

<i>In</i> <i>situ</i> scanning electron microscopy observation of the dynamic behavior of electromigration voids in passivated aluminum lines

Paul R. Besser, Michael C. Madden, Paul A. Flinn · Journal of Applied Physics · 1992 · 77 citations

Natural Sciences, Electrical Engineering, Materials Science +15

Electromigration induced transgranular slit failures in near bamboo Al and Al-2% Cu thin-film interconnects

John E. Sanchez, Oliver Kraft, Eduard Arzt · Applied Physics Letters · 1992 · 63 citations

Natural Sciences, Materials Engineering, Materials Science +14

The effect of stress-induced voiding on electromigration

S. Lytle, A. S. Oates · Journal of Applied Physics · 1992 · 40 citations

Engineering, Electrical Engineering, Materials Engineering +16

The Effect of Cu Addition to Al-Si Interconnects on Stress Induced Open-Circuit Failures

Shuichi Mayumi, Takahiro Umemoto, M. Shishino et al. · Reliability physics · 1987 · 38 citations

Engineering, Materials Engineering, Materials Science +17