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Influences of Substrate Alloying and Reflow Temperature on Bi Segregation Behaviors at Sn-Bi/Cu Interface

Materials ScienceMaterials EngineeringReflow TemperatureEngineeringBi Segregation BehaviorsPhysicsMaterial AnalysisSurface ScienceApplied PhysicsCondensed Matter PhysicsSubstrate AlloyingMetallurgical InteractionAlloy DesignAlloy PhaseInterface Property