A 77 GHz SiGe mixer in an embedded wafer level BGA package

Abstract

We present a fully operational 77 GHz SiGe mixer assembled in a chip-scale embedded wafer level BGA (eWLB) package. This innovative package has a footprint with a standard pad pitch of 0.5 mm and a standard package height of 0.4 mm. The results demonstrate an excellent potential of the eWLB package concept for mm-wave applications. The measured gain of the packaged mixer is in best case only 1 dB smaller than measured on-wafer. Further, we analyze the transition from the printed circuit board (PCB) to the chip in package. We compare the results of our analysis with the measured performance of the packaged mixers. We achieve a good agreement between simulations and measurements. Finally, we discuss the methods for improving the electrical performance of the packages assembled on the PCB.