Influence of processing conditions on the thermal and mechanical properties of SU8 negative photoresist coatings

TLDR

The study examined how curing parameters—baking temperature, baking time, and UV dosage—affect the thermal and mechanical properties of SU8 negative photoresist coatings. Thermal expansion coefficients were measured with PVT and TMA, while residual stress evolution under varying humidity was assessed via vibrational holographic interferometry. The glass‑transition temperature followed the baking temperature up to 220 °C, plateauing near 240 °C after full cross‑linking, and both Tg and shrinkage temperature (≈1.16× baking temp) were influenced by baking time.

Abstract

The thermal and mechanical properties of a new negative photoresist, SU8, were characterized. The influence of curing conditions, such as baking temperature, baking time and UV dosage, on the thermal and mechanical properties of the resultant coatings was studied in detail. It was found that the glass-transition temperature (Tg) of the coatings was coincident with the baking temperature over the temperature range of 25 °C–220 °C for coatings being baked for just 20 min. However, the Tg reached a limiting value (about 240 °C) once the cross-linking reaction was complete, and would not increase further with the baking temperature. The peak temperature of the dimension versus temperature plots, where heat shrinkage occurred, was about a factor of 1.16 times higher than the baking temperature for the temperature range studied. Both the Tg and the shrinkage temperature were affected by the baking time. The thermal expansion coefficients (TEC), including the volumetric TEC (αv), the in-plane TEC (α1) and the out-of-plane TEC (α2), were measured by a pressure–volume–temperature (PVT) apparatus and thermal–mechanical analyzer (TMA). Great residual stress could be generated during the process, and the change in residual stress with the environmental humidity was investigated using vibrational holographic interferometry.