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Microwave properties of MgB/sub 2/ thin films
13
Citations
16
References
2003
Year
Materials ScienceMaterials EngineeringElectrical EngineeringAdvanced Dielectric ResonatorEngineeringRf SemiconductorPhysicsApplied PhysicsSuperconductivityCondensed Matter PhysicsMicrowave CeramicMicrowave MeasurementThin Film Process TechnologyThin FilmsMicroelectronicsMicrowave EngineeringRutile PuckElectromagnetic Compatibility
The microwave surface impedance Z/sub s/=R/sub s/+j/spl omega//spl mu//sub 0//spl lambda/ of MgB/sub 2/ thin films was measured via advanced dielectric resonator (DR) techniques. First, the temperature dependence of the penetration depth /spl lambda/ measured with a sapphire puck at 17.9 GHz can be well fitted from 5 K close to T/sub c/ by the standard BCS integral expression assuming the reduced energy gap /spl Delta/(0)/kT/sub c/ to be as low as 1.0-1.1 assuming /spl lambda/(0)=100--110 nm. These results clearly indicate the s-wave nature of the order parameter. Similar good fits were achieved by an anisotropic one gap and an isotropic two-gap model. Second, the temperature dependence of surface resistance R/sub s/, as measured with a rutile puck, indicates an exponential behavior below about T/sub c//2 with a reduced energy gap being consistent with the one determined from the /spl lambda/ data. The R/sub s/ value at 4.2 K was found to be as low as 19 /spl mu//spl Omega/ at 7.2 GHz, which is comparable with that of a high-quality high temperature thin films of YBa/sub 2/Cu/sub 3/O/sub 7/. A higher-order mode at 17.9 GHz was employed to investigate the frequency f dependence of R/sub s//spl alpha/f/sup n(T)/. Our results revealed an decrease of n with increasing temperature ranging from n=2 below 8 K to n=1 close to T/sub c/. Finally, the microwave power handling of MgB/sub 2/ films was deduced and compared with values for YBa/sub 2/Cu/sub 3/O/sub 7/ films. We found that the power handling of MgB/sub 2/ is comparable or even better than that of YBa/sub 2/Cu/sub 3/O/sub 7/ films for temperature below 30 K.
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