Publication | Closed Access
A Semiconductor‐Nanowire Assembly of Ultrahigh Junction Density by the Langmuir–Blodgett Technique
121
Citations
30
References
2005
Year
EngineeringUniform RegistryNanodevicesLangmuir–blodgett TechniqueOptoelectronic DevicesSemiconductor NanostructuresSemiconductorsElectronic DevicesMaterials FabricationSemiconductor‐nanowire AssemblyNanostructure SynthesisNanoscale ScienceCompound SemiconductorMaterials ScienceSemiconductor TechnologyNanotechnologyNanomanufacturingSemiconductor MaterialConventional Fabrication TechniquesSurface NanoengineeringElectronic MaterialsUltrahigh Junction DensityNanomaterialsUltrathin ZnseApplied PhysicsNanofabricationNanostructures
The assembly of ultrathin ZnSe nanowires over large areas (see Figure) is achieved by a Langmuir–Blodgett technique in a single step with uniform registry, and without any further secondary technique for alignment. Ultrahigh packing density of junctions, exceeding over 60 × 103 μm–2, is achieved by subsequent deposition of a second two-dimensional nanowire assembly with a controlled angle between the two layers. The resulting network notably surpasses the limit of conventional fabrication techniques.
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