Carbon nanotube interconnects: a process solution

Abstract

The susceptibility of common interconnect metals to electromigration at current densities of 10/sup 6/ A/cm/sup 2/ or greater has been a concern. The ITRS Roadmap emphasizes interconnect technology as a critical element and calls for innovative material and process solutions. This talk will present the potential of carbon nanotubes (CNTs) as interconnects and a processing scheme to integrate them in device fabrication.