Creating In‐Plane Metallic‐Nanowire Arrays by Corner‐Mediated Electrodeposition

Abstract

A novel template-assisted electrochemical approach to fabricate in-plane arrays of copper nanowires with tunable width varying from 25 nm to more than 200 nm, which is realized by successive nucleation of copper at the concave corner of the polymer template and the substrate, is reported. We demonstrate that this method can be applied for fabricating complicated structures.