A novel electro-thermal simulation approach of power IGBT modules for automotive traction applications

Abstract

In this paper, a novel thermal compact model of IGBT power modules for automotive applications is proposed. This new technique combines the accuracy of the FEM approach with the fast computational performances of circuit simulators. Furthermore, a simple parameter definition method for power device models, which enables us to change the device characteristics dynamically, is introduced. These methods provide an excellent tool to investigate issues such as the temperature non-homogeneity in parallel-connected devices.