Quench propagation properties in HTS pancake coil

S. Shimizu, Atsushi Ishiyama, S.B. Kim

IEEE Transactions on Applied Superconductivity · 1999 · 10 citations · 2 references

Concepts

Abstract

In this paper, the authors present the results of experiments and computer simulations to make clear the quench propagation properties in Bi-2223/Ag superconducting multifilament tape. They developed a computer code based on the two dimensional finite element method (2-D FEM). Computed voltage and temperature traces during a quench agree well with the experimentally recorded voltage and temperature traces. Good agreement validates the computer code, making a useful tool in developing protection strategies for high-temperature superconducting (HTS) coils. Therefore, they simulate the quench process in a single pancake coil wound with Bi-2223/Ag superconducting multifilament tape with background magnetic field up to 10 T at 20 K using the developed computer code. The quench propagation properties and stability in HTS coils are discussed and compared with those in low-temperature superconducting (LTS) coils.

References

2