Japanese Journal of Applied Physics · 1990 · 29 citations · 5 references
Natural SciencesMaterials SciencePhysicsElectronic MaterialsPlasma PhysicsSurface ScienceHigh-temperature PlasmasThin-film DepositionDeposition RateDeposition Rate ControlDeposition Rate EffectsDeposition Rate OptimizationFilm ThicknessFilm Thickness ControlPlasma-enhanced DepositionSubstrate Temperature Effects
By applying positive bias voltage to a substrate in diamond CVD by a dc plasma jet of the Ar–H 2 –CH 4 system, the deposition rate increased more than twofold, and the maximum rate of 15 µm/min was obtained. The deposition area also increased but the uniformity of film thickness did not improve. Applying the bias voltage to a ring electrode around the substate increased the deposition rate by nearly the same amount without increasing the substrate temperature.
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