An Integrated LVDS Transmitter in 0.18-<inline-formula><tex-math notation="LaTeX">$\mu$</tex-math> </inline-formula>m CMOS Technology With High Immunity to EMI

Abstract

This paper presents an on-chip design topology that compensates the effects of electromagnetic interference (EMI) in a low-voltage differential signaling (LVDS) transmitter. The proposed structure enables the transmitter to maintain a wide differential opening by achieving a superior common-mode level independent driving current and common-mode feedback closed-loop gain. Direct power injection measurements illustrate that the proposed LVDS transmitter structure demonstrates a superior EMI immunity as it maintains an eye opening of at least 100 mVp-p in presence of a conductive EMI injection ranging from 150 to 2 GHz with an amplitude of up to 9 Vp-p. Additionally, transverse electromagnetic cell measurements validate the radiated immunity of the proposed integrated LVDS transmitter in presence of an EMI injection of 30 dBm (150 kHz-2 GHz). This EMI robust LVDS transmitter was designed using the UMC 0.18-μm CMOS process.